(+372) 38 46320 sales@brandner.ee
Tööstuse 17, 72720 Paide Estonia

Blind and buried vias

Blind and buried vias are used to connect the layers in the particularly dense design (HDI).

Blind vias are exposed only on one side of the board,
while Buried vias connect internal layers without being exposed on either surface.

In Brandner we drill blind and buried vias mechanically to ensure the quality of the holes.

For blind vias it is vital to maintain aspect ratio 1:1. It means that if
blind drills are needed, the drilling depth has to be less or equal to drill diameter.

Please do not forget it when planning a stackup for a board with blind vias.

By continuing to use the site, you agree to the use of cookies. more information

The cookie settings on this website are set to "allow cookies" to give you the best browsing experience possible. If you continue to use this website without changing your cookie settings or you click "Accept" below then you are consenting to this.

Close