Tuotantomahdollisuudet
Material
| For single and doublesided | Tg 135°C/Tg 170°C |  |
| For multilayer | Tg 170°C | |
| Min thickness for DS&ML | 0,36mm | |
| Min inner layer thickness | 0,1mm | |
| Min prepreg thickness | 0,063mm | |
| Max thickness for DS&ML | 2,4mm | |
| Materials on stock | See here | |
| Max layer count | 24 | |
Holes and wires
| Min hole drilled | 0,1mm | |
| Min blind via | 0,1mm | |
| Drill tolerance | +/- 0,1mm | |
| Max plugged hole with solder mask | 0,4mm | |
| Min annular ring on inner layer | 0,1mm | |
| Min annular ring on outer layer | 0,05mm | |
| Aspect ratio for blind vias | 1:1 | |
| Min distance drill to drill | 0,15mm | |
| Min distance drill to plane (vias 0,2mm -0,4mm) Min distance drill to plane (vias 0,1mm/0,15mm/0,5mm and up) | 0,15mm (on inner layer) 0,2mm (on inner layer) | |
| Min landing pad for blind via | 0,3mm (on inner layer) | |
| Min inner layer wire and gap | 0,075mm | |
| Min outer layer wire and gap | 0,06mm | |
| Min distance from wire to border | 0,2mm | |
| Min distance from V-cut to border | 0,4mm V-ura laskin | |
Solder mask and legend print
| Solder mask colors | green, black, white, blue, red | |
| Solder mask thickness | 20-25µ | |
| Min opening from pad | 0,05mm | |
| Min dam width | 0,075mm for green color | |
| 0,150 mm for other colors | ||
| NB! The vias with diameter 0,4 mm and smaller may contain solder mask residue! | ||
| Legend print colors | white, black | |
| Min line on legend print | 0,1mm | |
| Tolerance of alignment | ±25µ | |
NB! The markings with line thickness smaller than 0,1mm will be increased automatically!
NB! The markings on the solder mask openings will be removed!
Pads plating
| Hot air levelling Felder SN99Ag+ | 5-20µ minimum thickness of material 0,8mm; plated slot annular ring min. 0,5mm |
| Immersion gold ENIG | Ni 3-6µ; Au 0.05-0.125µ plated slot annular ring min. 0,2mm |
Mechanical
| Min router bit | 0,2mm |
| Max router bit | 2,5mm |
| Routing tolerance | ±0,1mm |
| V-cut | 30°; min core 0,2mm |
| Min material thickness for V-cut | 0,8mm |
| V-cut tolerance | ±0,3mm |
| Min board dimensions | 10 x 10mm |
| Max board dimensions | 360 x 460mm |
| Blind and buried vias Blind slots (Z-milling) Backdrilling |
Yes, see here Yes, see here Yes, see here |
Design rules
Outer layer
| Min pad for via | min. hole + 0,2mm |
| Min pad for component holes | min. hole + 0,3mm |
| Min conductor and space for foil 12µ | 0,065mm |
| Min conductor and space for foil 18µ | 0,075mm |
| Min conductor and space for foil 35µ | 0,125mm |
| Min conductor and space for foil 70µ | 0,25mm |
| Min distance between copper plane / hole | 0,125mm |
| Min distance between pad and copper | 0,075mm |
| Min distance from copper to V-cut center | 0,4mm |
| Min distance between wire and border | 0,2mm |
Inner layer
| Min pad | min. hole + 0,3mm |
| Min distance from copper plane and hole | 0,2mm |
| Min blind via landing pad | via + 0,2mm |
| Min conductor and space for foil 18µ | 0,075mm |
| Min conductor and space for foil 35µ | 0,125mm |
| Min conductor and space for foil 70µ (prepreg thickness at least 0,2mm) | 0,25mm |
If our design rules do not meet your requirements please consult with our Sales Assistants!