• The drill sizes are handled without extra metallization in holes.
• The wires and landscape are designed on the cutting area.
• The distance between the conductor and space will be left minimal even though the design will not require it.
• If the distance between the copper plane and hole in inner layers is 100µ or less, it might cause a short from material expansion.
• Since the routing tools are rounded, it is not possible to make 90° cut-outs without leaving the radius of the tool in the corner.
• The solder mask opening is too large between neighboring pads, which can cause shorts between them.
• The line width for marking is below 100µ.