Brandner PCB has improved the online construction of HDI PCB packages. The client or designer now has the excellent opportunity to customize construction along with blind and buried vias.

The program double-checks elementary construction links and warns of technologically unsuitable solutions. The minimum diameter for blind vias is 75µ. The completed construction can be downloaded in PDF format and added to the order or project documentation.

A helpful guide for beginner designers is also available.

Brandner PCB hopes that the created environment provides more detailed opportunities for transmitting documents between the PCB manufacturer and the client.