{"id":1002,"date":"2017-08-18T09:20:12","date_gmt":"2017-08-18T06:20:12","guid":{"rendered":"http:\/\/www.brandner.ee\/?page_id=1002\/"},"modified":"2025-08-13T09:53:30","modified_gmt":"2025-08-13T06:53:30","slug":"tuotantomahdollisuudet","status":"publish","type":"page","link":"https:\/\/www.brandner.ee\/fi\/tuotantomahdollisuudet\/tuotantomahdollisuudet\/","title":{"rendered":"Tuotantomahdollisuudet"},"content":{"rendered":"
<\/div>\n
\n

Tuotantomahdollisuudet<\/strong><\/h2>\n<\/div>\n
\n
\n<\/div>\n
Material<\/strong><\/div>\n\n\n\n\n\n\n\n\n\n\n
\u00a0For single and doublesided<\/td>\nTg 135\u00b0C\/Tg 170\u00b0C<\/td>\n\"\"<\/a><\/td>\n<\/tr>\n
\u00a0For multilayer<\/td>\nTg 170\u00b0C<\/td>\n\"\"<\/a><\/td>\n<\/tr>\n
\u00a0Min thickness for DS&ML<\/td>\n0,36mm<\/td>\n\"\"<\/a><\/td>\n<\/tr>\n
\u00a0Min inner layer thickness<\/td>\n0,1mm<\/td>\n\"\"<\/a><\/td>\n<\/tr>\n
\u00a0Min prepreg thickness<\/td>\n0,063mm<\/td>\n\"\"<\/a><\/td>\n<\/tr>\n
\u00a0Max thickness for DS&ML<\/td>\n2,4mm<\/td>\n\"\"<\/a><\/td>\n<\/tr>\n
\u00a0Materials on stock<\/td>\nSee here<\/a><\/td>\n\"\"<\/a><\/td>\n<\/tr>\n
\u00a0Max layer count<\/td>\n24<\/td>\n\"\"<\/a><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n
\n

Holes and wires<\/strong><\/p>\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
\u00a0Min hole drilled<\/td>\n0,1mm<\/td>\n<\/td>\n<\/tr>\n
\u00a0Min blind via<\/td>\n0,1mm<\/td>\n\"\"<\/a><\/td>\n<\/tr>\n
\u00a0Drill tolerance<\/td>\n+\/- 0,1mm<\/td>\n<\/td>\n<\/tr>\n
\u00a0Max plugged hole with solder mask<\/td>\n0,4mm<\/td>\n<\/td>\n<\/tr>\n
\u00a0Min annular ring on inner layer<\/td>\n0,1mm<\/td>\n\"\"<\/a><\/td>\n<\/tr>\n
\u00a0Min annular ring on outer layer<\/td>\n0,05mm<\/td>\n<\/td>\n<\/tr>\n
<\/td>\n<\/td>\n<\/td>\n<\/tr>\n
\u00a0Aspect ratio for blind vias<\/td>\n1:1<\/td>\n<\/td>\n<\/tr>\n
\u00a0Min distance drill to drill<\/td>\n0,15mm<\/td>\n\"\"<\/a><\/td>\n<\/tr>\n
\u00a0Min distance drill to plane (vias 0,2mm -0,4mm) Min distance drill to plane (vias 0,1mm\/0,15mm\/0,5mm and up)<\/td>\n0,15mm (on inner layer) 0,2mm (on inner layer)<\/td>\n\"\"<\/a><\/td>\n<\/tr>\n
\u00a0Min landing pad for blind via<\/td>\n0,3mm (on inner layer)<\/td>\n<\/td>\n<\/tr>\n
\u00a0Min inner layer wire and gap<\/td>\n0,075mm<\/td>\n\"\"<\/a><\/td>\n<\/tr>\n
\u00a0Min outer layer wire and gap<\/td>\n0,06mm<\/td>\n<\/td>\n<\/tr>\n
\u00a0Min distance from wire to border<\/td>\n0,2mm<\/td>\n\"\"<\/a><\/td>\n<\/tr>\n
\u00a0Min distance from V-cut to border<\/td>\n0,4mm V-ura laskin<\/a><\/td>\n\"\"<\/a><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n
\n

Solder mask and legend print<\/strong><\/p>\n\n\n\n\n\n\n\n\n\n\n\n
\u00a0Solder mask colors<\/td>\ngreen, black, white, blue, red<\/td>\n\"\"<\/a><\/td>\n<\/tr>\n
\u00a0Solder mask thickness<\/td>\n20-25\u00b5<\/td>\n<\/td>\n<\/tr>\n
\u00a0Min opening from pad<\/td>\n0,05mm<\/td>\n<\/td>\n<\/tr>\n
\u00a0Min dam width<\/td>\n0,075mm for green color<\/td>\n<\/td>\n<\/tr>\n
<\/td>\n0,150 mm for other colors<\/td>\n<\/td>\n<\/tr>\n
NB!\u00a0<\/strong>The vias with diameter 0,4 mm and smaller may contain solder mask residue!<\/td>\n<\/tr>\n
\u00a0Legend print colors<\/td>\nwhite, black<\/td>\n<\/td>\n<\/tr>\n
\u00a0Min line on legend print<\/td>\n0,1mm<\/td>\n<\/td>\n<\/tr>\n
\u00a0Tolerance of alignment<\/td>\n\u00b125\u00b5<\/td>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

NB!<\/strong>\u00a0The markings with line thickness smaller than 0,1mm will be increased automatically!<\/p>\n

NB!<\/strong> The markings on the solder mask openings will be removed!<\/p>\n

\n

P<\/strong>ads plating<\/strong><\/p>\n\n\n\n\n
\u00a0Hot air levelling Felder SN99Ag+<\/td>\n5-20\u00b5 minimum thickness of material 0,8mm; plated slot annular ring min. 0,5mm<\/td>\n<\/tr>\n
\u00a0Immersion gold ENIG<\/td>\nNi 3-6\u00b5; Au 0.05-0.125\u00b5 plated slot annular ring min. 0,2mm<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n
\n

Mechanical<\/strong><\/p>\n\n\n\n\n\n\n\n\n\n\n\n\n
Min router bit<\/td>\n0,2mm<\/td>\n<\/tr>\n
Max router bit<\/td>\n2,5mm<\/td>\n<\/tr>\n
Routing tolerance<\/td>\n\u00b10,1mm<\/td>\n<\/tr>\n
V-cut<\/td>\n30\u00b0; min core 0,2mm<\/td>\n<\/tr>\n
Min material thickness for V-cut<\/td>\n0,8mm<\/td>\n<\/tr>\n
V-cut tolerance<\/td>\n\u00b10,3mm<\/td>\n<\/tr>\n
Min board dimensions<\/td>\n10 x 10mm<\/td>\n<\/tr>\n
Max board dimensions<\/td>\n360 x 460mm<\/td>\n<\/tr>\n
Blind and buried vias
\nBlind slots (Z-milling)
\nBackdrilling<\/td>\n		Yes, see here<\/a>
\nYes, see here<\/a>
\nYes, see here<\/a><\/td>\n<\/tr>\n
<\/td>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n
\n

Design rules<\/strong><\/h2>\n
\n

Outer layer<\/strong><\/p>\n\n\n\n\n\n\n\n\n\n\n\n\n
\u00a0Min pad for via<\/td>\nmin. hole + 0,2mm<\/td>\n<\/tr>\n
\u00a0Min pad for component holes<\/td>\nmin. hole + 0,3mm<\/td>\n<\/tr>\n
\u00a0Min conductor and space for foil 12\u00b5<\/td>\n0,065mm<\/td>\n<\/tr>\n
\u00a0Min conductor and space for foil 18\u00b5<\/td>\n0,075mm<\/td>\n<\/tr>\n
\u00a0Min conductor and space for foil 35\u00b5<\/td>\n0,125mm<\/td>\n<\/tr>\n
\u00a0Min conductor and space for foil 70\u00b5<\/td>\n0,25mm<\/td>\n<\/tr>\n
\u00a0Min distance between copper plane \/ hole<\/td>\n0,125mm<\/td>\n<\/tr>\n
\u00a0Min distance between pad and copper<\/td>\n0,075mm<\/td>\n<\/tr>\n
\u00a0Min distance from copper to V-cut center<\/td>\n0,4mm<\/td>\n<\/tr>\n
\u00a0Min distance between wire and border<\/td>\n0,2mm<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

Inner layer<\/strong><\/p>\n\n\n\n\n\n\n\n\n
\u00a0Min pad<\/td>\nmin. hole + 0,3mm<\/td>\n<\/tr>\n
\u00a0Min distance from copper plane and hole<\/td>\n0,2mm<\/td>\n<\/tr>\n
\u00a0Min blind via landing pad<\/td>\nvia + 0,2mm<\/td>\n<\/tr>\n
\u00a0Min conductor and space for foil 18\u00b5<\/td>\n0,075mm<\/td>\n<\/tr>\n
\u00a0Min conductor and space for foil 35\u00b5<\/td>\n0,125mm<\/td>\n<\/tr>\n
\u00a0Min conductor and space for foil 70\u00b5 (prepreg thickness at least 0,2mm)<\/td>\n0,25mm<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n
\n

If our design rules do not meet your requirements please consult with our Sales Assistants<\/a>!<\/strong><\/p>\n","protected":false},"excerpt":{"rendered":"

Tuotantomahdollisuudet Material \u00a0For single and doublesided Tg 135\u00b0C\/Tg 170\u00b0C \u00a0For multilayer Tg 170\u00b0C \u00a0Min thickness for DS&ML 0,36mm \u00a0Min inner layer thickness 0,1mm \u00a0Min prepreg thickness 0,063mm \u00a0Max thickness for DS&ML 2,4mm \u00a0Materials on stock See here \u00a0Max layer count 24 Holes and wires \u00a0Min hole drilled 0,1mm \u00a0Min blind via 0,1mm \u00a0Drill tolerance +\/- …<\/p>\n","protected":false},"author":31,"featured_media":0,"parent":999,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"template_content-sidebar.php","meta":{"footnotes":""},"yoast_head":"\nTuotantomahdollisuudet - Brandner<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.brandner.ee\/fi\/tuotantomahdollisuudet\/tuotantomahdollisuudet\/\" \/>\n<meta property=\"og:locale\" content=\"fi_FI\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Tuotantomahdollisuudet - 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