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Design rules

Please notice that the rules given here are accommodated for our production to get best results possible. Other manufacturers may have their own specific design rules.

 

Design rules


Outer layer

 Min pad for via  min.hole + 0.2mm
 Min pad for component holes  min.hole + 0.3mm
 Min conductor and space for foil 12µ  0.05mm
 Min conductor and space for foil 18µ  0.075mm
 Min conductor and space for foil 35µ  0.125mm
 Min conductor and space for foil 70µ  0.25mm
 Min distance between copper plane / hole  0.125mm
 Min distance between pad and copper   0.075mm
 Min distance from copper to V-cut center  v-cut calculator
 Min distance between wire and border  0.2mm

 

 

Inner layer

 Min pad  min.hole + 0.3mm
 Min distance from copper plane and hole  0.25mm
 Min blind via landing pad  via + 0.2mm
 Min conductor and space for foil 18µ  0.075mm
 Min conductor and space for foil 35µ  0.125mm
 Min conductor and space for foil 70µ  0.25mm

 

We do not recommend to use minimal values given here unless it is absolutely necessary concerning your design goals.

For parameters not specified here please refer to our production capabilities section.

For stackup possibilities please see our stackup builder.

If in doubt, please ask cam@brandner.ee