BRANDNER PCB OÜ
Production Capabilities

Material


 For single and doublesided  MC100,Tg 135°C
 For multilayer  Tg 170°C
 Min thickness for DS&ML  0.36mm
 Min innerlayer thickness  0.1mm  
 Min prepreg thickness  0.063mm
 Max thickness for DS&ML  2.4mm
 Materials on stock  take a look
 Max layer count  24



Holes and wires


 Min hole drilled  0.1mm
 Min blind via  0.1mm
 Max hole filled with copper  soon available
 Max plugged hole with solder mask  0.4mm
 Min annular ring on innerlayer  0.1mm
 Min annular ring on outerlayer  0.05mm
 Aspect ratio  1:16
 Aspect ratio for blind vias  1:1
 Min distance drill to drill  0.15mm
 Min distance drill to plane  0.15mm(on innerlayer)
 Min landing pad for blind via  0.2mm(on innerlayer)
 Min innerlayer wire and gap  0.075mm
 Min outerlayer wire and gap  0.05mm  
 Min distance from wire to border  0.2mm
 Min distance from V-cut to border  0.4mm



Solder mask and legend print


 Solder mask colors    green, black, white, blue, red
 Solder mask thickness    20-25µ  
 Min opening from pad    0.05mm/2mils  
 Min dam width    0.075mm/3mils for green color  
     0.150mm/6mils for other colors  
NB! The vias with diameter 0.4 mm and smaller may contain solder mask residue!
 Legend print colors    white, black  
 Min line on legend print    0.1mm/3.9mils  
 Min distance from pad to  legend    0.150mm  
 Tolerance of alignment    ±25µ  

NB! The markings with line thickness smaller than 0,1mm will be removed!

The markings on the solder mask openings or closer to the pad than 0.15mm will be removed!

Pads plating


 Hot air levelling Felder SN99Ag+  5-20µ
 Immersion gold ENIG  Ni 3-6µ;Au 0.05-0.12µ

 
Mechanical


 Min router bit  0.2mm          NEW!
 Max router bit  2.5mm
 Routing tolerance  ±0.1mm
 V-cut  30°;min core 0.2mm
 Min material thickness for V-cut  0.8mm
 V-cut tolerance  ±0.3mm
 Min board dimensions  10 x 10mm
 Max board dimensions  360 x 460mm
 Blind slots (Z-milling)  Yes                NEW!
 Backdrilling  Yes, see here NEW!

   
Design rules


Outer layer

 Min pad for via  min.hole + 0.2mm
 Min pad for component holes  min.hole + 0.3mm
 Min conductor and space for foil 12µ  0.05mm
 Min conductor and space for foil 18µ  0.075mm
 Min conductor and space for foil 35µ  0.125mm
 Min conductor and space for foil 70µ  0.25mm
 Min distance between copper plane / hole  0.125mm
 Min distance between pad and copper   0.075mm
 Min distance from copper to V-cut center  0.4mm
 Min distance between wire and border  0.2mm

  
Inner layer

 Min pad  min.hole + 0.3mm
 Min distance from copper plane and hole  0.25mm
 Min blind via landing pad  via + 0.2mm
 Min conductor and space for foil 18µ  0.075mm
 Min conductor and space for foil 35µ  0.125mm
 Min conductor and space for foil 70µ  0.25mm